Started from the screen printing process, we have contributed to high functionality of electrical products. And also, we are developing fluorine coating materials according to customers request and they are applied for such as gAnti-smudgeh, gWater&Oil repllenth, hMoisture proofh, hOil berrierh, hProtection from corrosion gash, gWater proofh, hAnti-rusth
Hole plugging service for Printed Circuit Board
gFLAT PLUG PROCESSh
yConceptz
To plug(fill) through holes with various pastes in high density buid-up or pad-on-via printed circuit board and planarize(flatten) the surface after plugged
yFeaturesz
- Selective hole(via) plugging is possible by using our special screen mask.
- Void free plugging for small hole (0.1mm)and High aspect(up to 40) is possible by using vacuum printer.
- Various sized holes can be plugged simultaneously by using vacuum printer.
- Thin (0.12mm~) to Thick (~6.5mm)board can be planarized by using more than 20 planarizing lines.
- Chemical etching(for surface copper layer) after hole plugging is effective to preserve copper layer(thickness) inside plugged holes.
- Any kind of paste(resin~conductive) can be used. We can propose proper paste for your usage.
£High aspect TH plugging
£TH plugging by using conductive paste
gBlind via(laser via)plugging processh
yConceptz
To plug(fill) blind vias with various pastes on the surface of the most advanced buid-up printed circuit board and planarize(flatten).
yFeaturesz
- Compared to ordinary copper plating, surface copper layer is much thinner and suitable for fine patterning process.
- Both of TH and blind via can be plugged simultaneously by using vacuum printer.
- Any size or high aspect hole or skip via can be filled simultaneously.
- Any kind of paste is applicable by using our screen printing skills.
gUnder Coat processh (Surface flatten/ Gap filling process)
yConceptz
Filling resin paste into the gap between patterns flatten the surface like additive process.
Fully Flat surface is so effective for SMT mounting and chip bonding quality that improves all the pattern reliability on board.
£Before gUnder Coath
£After hUnder Coath
yFeaturesz
- Filling gaps and plugging any kind of holes by only 1 squeegee stroke.
- Step buffing and scrabing process minimize the surface copper reduction.
- Selective filling is possible by using screen mask.
yTypical applicationz
£PCB for Encoder switch
£Embedded PCB
Contact
Please contact us if you have any question.
NODA SCREEN CO.,LTD.
Tell +81-(0)568-79-0222^FAX +81-(0)568-79-0639